Intelligent welding technology without hidden crack

Intelligent welding technology without hidden cracks increases the power and efficiency of components, and improves the load resistance of components.

Reasonable component size

M10 silicon wafers are designed with version 54 to fully consider component size and weight limitations in distributed applications.

Packaging and transportation compatibility

Mainstream mature packaging scheme, to achieve high reliability and low cost transportation.

Gallium-doped technology

Gallium-doped technology can overcome the optical attenuation of components and guarantee the long-term power generation stability of components.

Optimize electrical parameters

The working current of the module is about 13A, which perfectly fits the mainstream distributed series inverter.

Mechanical parameter

Battery arrangement: 108 (6×18)

Junction box Split junction box: IP68, 3 diodes

Component weight: 20.8kg

Component size: 1722×1134×30mm

Packaging Information:

36 RMB/pallet

216 pieces /20 feet flat cabinet

936 pieces /40 feet high cabinet

1008 pieces / 13.5m tablet

1224 pieces /17.5 meter slab

Electrical performance parameters (STC test)

STC: Standard Test Conditions

Electrical performance parameters (NOTC test)

NOCT: rated Normal Operating Cell Temperature

Load capacity

Maximum positive static load (e.g. snow, wind) : 5400Pa

Maximum static load on back (such as wind) : 2400Pa

Through the hail test: diameter 25mm, impact speed 23m/s

Temperature coefficient (STC test)

Short-circuit current (Isc) temperature coefficient: +0.050%/℃

Open circuit voltage (Voc) temperature coefficient: -0.265%/℃

Peak power (Pmax) temperature coefficient: -0.340%/℃

STC: Standard Test Conditions